Rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC)

US9018050B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9018050-B2
Application numberUS-201314051192-A
CountryUS
Kind codeB2
Filing dateOct 10, 2013
Priority dateOct 11, 2012
Publication dateApr 28, 2015
Grant dateApr 28, 2015

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC) comprises a multilayer sheet in a rolled configuration comprising multiple turns about a longitudinal axis, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer. The conductive pattern layer comprises a first conductive film and a second conductive film separated from the first conductive film in a rolling direction. In the rolled configuration, the first conductive film surrounds the longitudinal axis, and the second conductive film surrounds the first conductive film. The first conductive film serves as a signal line and the second conductive film serves as a conductive shield for the rolled-up transmission line structure.

First claim

Opening claim text (preview).

What is claimed is: 1. A rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC), the rolled-up transmission line structure comprising: a multilayer sheet in a rolled configuration comprising multiple turns about a longitudinal axis, the multilayer sheet comprising a conductive pattern layer on a strain-relieved layer, the conductive pattern layer comprising a first conductive film separated from a second conductive film in a rolling direction, where…

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What does patent US9018050B2 cover?
A rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC) comprises a multilayer sheet in a rolled configuration comprising multiple turns about a longitudinal axis, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer. The conductive pattern layer comprises a first conductive film and a second conductive film separated from the…
Who is the assignee on this patent?
Univ Illinois
What technology area does this patent fall under?
Primary CPC classification H01F27/2804. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).