Well Modulation for Defect Inspection
US-2024079278-A1 · Mar 7, 2024 · US
US9018048B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9018048-B2 |
| Application number | US-201314032123-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 19, 2013 |
| Priority date | Sep 27, 2012 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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Official abstract text for this publication.
A process for manufacturing a semiconductor device, wherein a semiconductor layer is formed on a body of semiconductor material; a first mask is formed on the semiconductor layer; a first conductive region is implanted in the body using the first mask; a second mask is formed laterally and complementarily to the first mask, at least in a projection in a plane parallel to the surface of the body; a second conductive region is implanted in the body using the second mask, in an adjacent and complementary position to the first conductive region; spacers are formed on the sides of the second mask region, to form a third mask aligned to the second mask; and, using the third mask, portions of the semiconductor layer are removed to form a gate region.
Opening claim text (preview).
The invention claimed is: 1. A process for manufacturing a semiconductor device, comprising: forming a semiconductor layer on a surface of a semiconductor body; forming a first mask on the semiconductor layer; forming a first conductive region in the body by introducing a first dopant species into the body using the first mask; forming a second mask laterally and complementarily to the first mask, at least in a projection in a plane parallel to the surface of the body; for…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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