MEMS Fabrication Process with Two Cavities Operating at Different Pressures
US-2015375995-A1 · Dec 31, 2015 · US
Method of encapsulating a micro-device by anodic bonding
US9018043B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9018043-B2 |
| Application number | US-201414198947-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 6, 2014 |
| Priority date | Mar 13, 2013 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A method for encapsulating at least one micro-device, comprising at least the following steps: bonding a face of a first substrate comprising at least one material impermeable to noble gases, in contact with a second substrate comprising glass and with a thickness of about 300 μm or more; etching at least one cavity through the second substrate such that side walls of the cavity are at least partly formed by remaining portions of the second substrate and that an upper wall of the cavity is formed by part of said face of the first substrate; anodic bonding of the remaining portions of the second substrate in contact with a third substrate in which the micro-device is formed, such that the micro-device is encapsulated in the cavity.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for encapsulating at least one micro-device, comprising at least the following steps: bonding a face of a first substrate comprising at least one material impermeable to noble gases, in contact with a second substrate comprising glass and with a thickness of about 300 μm or more; etching at least one cavity through the second substrate such that side walls of the cavity are at least partly formed by remaining portions of the second substrate…
Assignees
Inventors
Classifications
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
- B81C1/00269Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9018043B2 cover?
- A method for encapsulating at least one micro-device, comprising at least the following steps: bonding a face of a first substrate comprising at least one material impermeable to noble gases, in contact with a second substrate comprising glass and with a thickness of about 300 μm or more; etching at least one cavity through the second substrate such that side walls of the cavity are …
- Who is the assignee on this patent?
- Commissariat Energie Atomique, Commissariat Energie Atomique
- What technology area does this patent fall under?
- Primary CPC classification B81C1/00269. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).