Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
Circuit module and method of producing circuit module
US9018039B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9018039-B2 |
| Application number | US-201414517424-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 17, 2014 |
| Priority date | Aug 8, 2013 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of producing a circuit module, comprising: mounting mount components including an RF (Radio Frequency) component configuring an RF circuit on a mount surface of a circuit substrate, forming a sealing body for covering the mount component on the mount surface having a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness, the first sealing body section coverin…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9018039B2 cover?
- A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second t…
- Who is the assignee on this patent?
- Taiyo Yuden Kk
- What technology area does this patent fall under?
- Primary CPC classification H10W42/20. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).