Preparation method for dry film solder resist and film laminate used therein
US-2015366070-A1 · Dec 17, 2015 · US
US9017927B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9017927-B2 |
| Application number | US-201313775549-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 25, 2013 |
| Priority date | Feb 25, 2013 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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A method of patterning a conductive polymer includes providing a conductive polymer layer coated over a first support followed by pattern-wise transferring a layer containing polyvinyl acetal from a second support onto the conductive polymer to form a mask with at least one opening. The masked conductive polymer is subjected to treatment through the opening that changes the conductivity of the conductive polymer by at least one order of magnitude in areas not covered by the mask.
Opening claim text (preview).
The invention claimed is: 1. A method of patterning a conductive polymer comprising: a) providing a conductive polymer layer coated over a first support; b) pattern-wise transferring a layer containing polyvinyl acetal from a second support onto the conductive polymer to form a mask with at least one opening, wherein the layer containing polyvinyl acetal further includes organic or inorganic particles; and c) subjecting the masked conductive polymer to treatment through the op…
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