Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US9017905B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9017905-B2 |
| Application number | US-201314033569-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 23, 2013 |
| Priority date | Sep 27, 2012 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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In a chemically amplified positive resist composition comprising (A) a base resin, (B) a photoacid generator, (C) a thermal crosslinker, and (D) an organic solvent, the base resin is a specific polymer and the crosslinker is a siloxane compound. A coating of the composition is readily developable in aqueous alkaline solution. On heat treatment, it forms a cured resist pattern film of satisfactory profile.
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The invention claimed is: 1. A chemically amplified positive resist composition comprising (A) a base resin, (B) a photoacid generator, (C) a thermal crosslinker, and (D) an organic solvent, wherein said base resin (A) is a polymer comprising recurring units having the general formula (1): wherein R 1 is each independently hydrogen, hydroxyl, straight or branched alky…
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