Bonded patches with bond line control

US9017499B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9017499-B2
Application numberUS-61381009-A
CountryUS
Kind codeB2
Filing dateNov 6, 2009
Priority dateDec 5, 2008
Publication dateApr 28, 2015
Grant dateApr 28, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A patch is used to rework an area of a structure. The patch is bonded to the structure by a layer of adhesive. A spacer placed between the patch and the structure is used to control the thickness of the adhesive and/or a bondline.

First claim

Opening claim text (preview).

What is claimed: 1. A method of reworking an area of a structure, comprising: placing a spacer over the area, the spacer comprising a screen, the screen having a thickness substantially the same as diameters of a plurality of beads, the screen further comprising openings sized to allow the plurality of beads to pass through the openings; and thereafter placing a layer of adhesive and the plurality of beads on the spacer; placing a patch over the spacer such that the layer of adhesive is between the spacer and the patch. 2. The method of claim 1 , wherein: the layer of adhesive and the plurality of beads move through the spacer to the area. 3. The method of claim 1 , further comprising: compacting the patch against the layer of adhesive, wherein the plurality of beads limits compaction of the layer of adhesive as the patch is compacted against the layer of adhesive. 4. The method of claim 3 , further comprising: placing an anti-caul plate around a periphery of the patch, the anti-caul plate surrounding an entirety of the patch; and wherein compacting the patch comprises compacting using a caul plate covering the entirety of the patch and also covering at least a portion of the anti-caul plate. 5. The method of claim 3 , further comprising: removing excess adhesive from the patch. 6. The method of claim 3 , further comprising: preparing the patch, including forming a plurality of perforations in the patch that allow escape of air from beneath the patch as the patch is compacted. 7. The method of claim 3 , further comprising: limiting pressure applied to peripheral portions of the patch as the patch is being compacted. 8. The method of claim 1 , wherein said patch is applied to conform to a surface of said structure adjacent said layer of adhesive. 9. The method of claim 8 , wherein the surface of said structure comprises at least one of a curve, a contour, a depression, and a deformation. 10. The method of claim 9 , wherein said patch comprises at least one of curves, contours, and tapers. 11. A method of bonding a patch on structure, comprising: applying a layer of adhesive to an area of the structure; placing a spacer on the area of the structure, the spacer comprising both a plurality of beads and a screen, the screen having a first thickness substantially the same as diameters of the plurality of beads, the screen further comprising openings sized to allow the plurality of beads to pass through the openings; using the spacer to control a second thickness of the layer of adhesive, the layer of adhesive extending over substantially an entirety of the area; following placing the spacer, placing a patch on the spacer and over the area; and compacting the patch against the layer of adhesive. 12. The method of claim 11 , further comprising: removing excess adhesive from the patch. 13. The method of claim 11 , further comprising: curing the layer of adhesive. 14. The method of claim 11 , wherein the second thickness of the layer of adhesive is uniform. 15. The method of claim 11 , further comprising: placing an anti-caul plate around a periphery of the patch, the anti-caul plate surrounding an entirety of the patch; and wherein compacting the patch comprises compacting using a caul plate covering the entirety of the patch and also covering at least a portion of the anti-caul plate. 16. A method of reworking a composite aircraft structure in the field, comprising: preparing an area of the structure to be reworked; forming a patch including forming perforations in the patch; applying a layer of adhesive and a plurality of beads to the area such that said layer of adhesive extends over substantially an entirety of the area; placing a spacer on the area, the spacer comprising a screen, the screen having a first thickness substantially the same as diameters of the plurality of beads, the screen further comprising openings sized to allow the plurality of beads to pass through the openings; using the spacer to control a second thickness of the layer of adhesive to be about the first thickness of the screen; removing the spacer, wherein beads of the plurality of beads maintain the second thickness of the layer of adhesive; applying the patch to the structure over the beads; removing excess adhesive from the patch; thereafter placing a caul plate over the patch; placing an anti-caul plate between the caul plate and the structure such that said anti-caul plate surrounds an outer periphery of said patch; installing a pressure applicator over the combination of the patch, the caul plate, and the anti-caul plate; using the pressure applicator to apply pressure to the patch through the caul plate, wherein the anti-caul plate limits the pressure at the periphery of the patch; installing a heat pack over the patch; and using the heat pack to cure the layer of adhesive.

Assignees

Inventors

Classifications

  • containing reinforcements, fillers or inserts · CPC title

  • B29C73/10Primary

    using patches sealing on the surface of the article (B29C73/14 takes precedence) · CPC title

  • Joining of substantially the whole surface of the articles (methods or apparatus for laminating B32B37/00) · CPC title

  • being spherical, e.g. particles or powders · CPC title

  • said distance pieces being non-integral with the parts to be joined, e.g. particles · CPC title

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9017499B2 cover?
A patch is used to rework an area of a structure. The patch is bonded to the structure by a layer of adhesive. A spacer placed between the patch and the structure is used to control the thickness of the adhesive and/or a bondline.
Who is the assignee on this patent?
Evens Michael W, Anderson David M, Blanchard Steve, and 3 more
What technology area does this patent fall under?
Primary CPC classification B29C73/10. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).