Breaking-in and cleaning method and apparatus for wafer-cleaning brush
US-2024066566-A1 · Feb 29, 2024 · US
Deposition chamber cleaning method including stressed cleaning layer
US9017486B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9017486-B2 |
| Application number | US-87812810-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 9, 2010 |
| Priority date | Sep 9, 2010 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A method for cleaning a deposition chamber includes forming a deposited layer over an interior surface of the deposition chamber, wherein the deposited layer has a deposited layer stress and a deposited layer modulus; forming a cleaning layer over the deposited layer, wherein a material comprising the cleaning layer is selected such that the cleaning layer adheres to the deposited layer, and has a cleaning layer stress and a cleaning layer modulus, wherein the cleaning layer stress is higher than the deposited layer stress, and wherein the cleaning layer modulus is higher than the deposited layer modulus; and removing the deposited layer and the cleaning layer from the interior of the deposition chamber.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for cleaning a deposition chamber, the method comprising: forming a deposited layer consisting of a deposited layer material on a substrate of a semiconductor manufacturing process and over an interior surface of the deposition chamber, wherein the deposited layer is formed by chemical vapor deposition; removing the substrate of the semiconductor manufacturing process from the interior of the deposition chamber after formation of the deposit…
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Classifications
- B08B7/04Primary
Operations & Transport · mapped topic
- B08B7/0014Primary
Operations & Transport · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US9017486B2 cover?
- A method for cleaning a deposition chamber includes forming a deposited layer over an interior surface of the deposition chamber, wherein the deposited layer has a deposited layer stress and a deposited layer modulus; forming a cleaning layer over the deposited layer, wherein a material comprising the cleaning layer is selected such that the cleaning layer adheres to the deposited layer, and ha…
- Who is the assignee on this patent?
- Cheng Tien-Jen, Li Zhengwen, Wong Keith Kwong Hon, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification B08B7/04. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).