A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
Copper plating solution and method for preparing the same
US9017463B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9017463-B2 |
| Application number | US-201414550441-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 21, 2014 |
| Priority date | May 22, 2012 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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Abstract
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A copper plating solution and a method for preparing a copper plating solution are provided. The copper plating solution comprises: a copper salt, a complexing agent, a stabilizer, a reducing agent, a surfactant, a hydroxyl-terminated polyoxypropylene ether, and a sodium trisulfide-isothiourea-propane sulfonate.
First claim
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What is claimed is: 1. A copper plating solution, comprising: a copper salt, a complexing agent, a stabilizer, a reducing agent, a surfactant, a hydroxyl-terminated polyoxypropylene ether, and a sodium trisulfide-isothiourea-propane sulfonate. 2. The copper plating solution according to claim 1 , wherein the copper salt has a concentration ranging from about 5 g/L to about 20 g/L. 3. The copper plating solution according to c…
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- C23C18/405Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US9017463B2 cover?
- A copper plating solution and a method for preparing a copper plating solution are provided. The copper plating solution comprises: a copper salt, a complexing agent, a stabilizer, a reducing agent, a surfactant, a hydroxyl-terminated polyoxypropylene ether, and a sodium trisulfide-isothiourea-propane sulfonate.
- Who is the assignee on this patent?
- Byd Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C23C18/405. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).