Modular electronic prototyping platforms
US-12177969-B2 · Dec 24, 2024 · US
Printed circuit board and method for manufacturing the same
US9013894B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9013894-B2 |
| Application number | US-201314022611-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 10, 2013 |
| Priority date | Sep 14, 2012 |
| Publication date | Apr 21, 2015 |
| Grant date | Apr 21, 2015 |
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- Title
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Abstract
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A printed circuit board includes: a substrate; a land that is disposed on a surface of the substrate, and includes a central portion and a plurality of extended portions, the central portion having the same shape and the same size as a land of a surface mount device, and the extended portions being up-and-down symmetry and right-and-left symmetry with respect to a straight line which passes through the center of the central portion; gaps that are disposed on the surface of the substrate, each of the gaps being disposed on a periphery of the central portion and between the extended portions; and a resist that is disposed on the surface of the substrate, and has an opening portion formed at a position corresponding to the central portion and the gaps.
First claim
Opening claim text (preview).
What is claimed is: 1. A printed circuit board comprising: a substrate; a land that is disposed on a surface of the substrate, and includes a central portion and a plurality of extended portions, the central portion having the same shape and the same size as a land of a surface mount device, and the extended portions being up-and-down symmetry and right-and-left symmetry with respect to a straight line which passes through the center of the central portion; gaps that are dispo…
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Frequently asked questions
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- What does patent US9013894B2 cover?
- A printed circuit board includes: a substrate; a land that is disposed on a surface of the substrate, and includes a central portion and a plurality of extended portions, the central portion having the same shape and the same size as a land of a surface mount device, and the extended portions being up-and-down symmetry and right-and-left symmetry with respect to a straight line which passes thr…
- Who is the assignee on this patent?
- Fujitsu Component Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K1/116. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).