Semiconductor packages and methods for producing the same

Patent metadata

Field	Value
Publication number	US-9013890-B2
Application number	US-201213348531-A
Country	US
Kind code	B2
Filing date	Jan 11, 2012
Priority date	Mar 26, 2010
Publication date	Apr 21, 2015
Grant date	Apr 21, 2015

Abstract

In one embodiment, a semiconductor package includes an isolating container having a recess, which forms an inner membrane portion and an outer rim portion. The rim portion is thicker than the membrane portion. The package includes a semiconductor chip disposed in the recess and a backplane disposed under the membrane portion of the isolating container.

First claim

What is claimed is:

1. A semiconductor package comprising:
a first isolating container comprising a dielectric material, the first isolating container having a first recess thereby forming an inner membrane portion and an outer rim portion, the rim portion being thicker than the membrane portion;
a first semiconductor chip disposed in the first recess;
a first backplane disposed under the membrane portion of the first isolating container; and
an encapsulant disposed around the first isolating container, the first semiconductor chip, and the first backplane, wherein the encapsulant is a different material from the dielectric material of the first isolating container.

2. The package of claim 1 , wherein the first isolating container comprises a glass.

3. The package of claim 1 , wherein the first isolating container comprises a material selected from the group consisting of organic material, sintered ceramic, and quartz.

4. The package of claim 1 , further comprising a top conductive layer disposed on a top surface of the first isolating container between the first semiconductor chip and the first isolating container and a connection coupling the top conductive layer to a potential node on the first semiconductor chip.

5. The package of claim 4 , further comprising an adhesive layer disposed between the top conductive layer and the first semiconductor chip.

6. The package of claim 5 , wherein the adhesive layer is conductive.

7. The package of claim 4 , wherein the top conductive layer is disposed on a top surface of the membrane portion but not a top surface of the rim portion.

8. The package of claim 4 , wherein the top conductive layer is disposed on a top surface of the membrane portion and a top surface of the rim portion.

9. The package of claim 4 , wherein the top conductive layer is disposed on a top surface of the membrane portion and sidewalls of the first recess but not a top surface of the rim portion.

10. The package of claim 1 , further comprising a bottom conductive layer disposed on a bottom surface of the isolating container between the first backplane and the first isolating container and a connection coupling the bottom conductive layer to a backplane potential node on the first backplane.

11. The package of claim 1 , wherein the encapsulant comprises a mold compound, and wherein a portion of the mold compound is disposed within the first recess between the first semiconductor chip and the first isolating container.

12. The package of claim 1 , wherein the first recess of the first isolating container has bowl shaped sidewalls.

13. The package of claim 1 , wherein the first recess of the first isolating container has trapezoidal sidewalls, wherein sidewalls of the first recess of the first isolating container have rounded corners.

14. The package of claim 1 , wherein the semiconductor chip comprises a sensor.

15. The package of claim 1 , wherein the first isolating container has a step or channel on an outer sidewall.

16. The package of claim 1 , further comprising:
a second isolating container having a second recess;
a second semiconductor chip disposed in the second recess; and
a second backplane disposed under the second isolating container.

17. The package of claim 1 , further comprising:
a second recess disposed in the first isolating container;
a second semiconductor chip disposed in the second recess; and
a second backplane disposed under the first isolating container.

18. The package of claim 17 , wherein the first backplane is coupled to a first current rail node, and wherein the second backplane is coupled to a different current rail node from the first current rail.

19. The package of claim 1 , further comprising a circuit board coupled to the first semiconductor chip.

20. The package of claim 1 , wherein the dielectric material of the first isolating container has a higher dielectric strength than the encapsulant.

21. The package of claim 1 , wherein the dielectric material of the first isolating container has a larger band gap than the encapsulant.

22. The package of claim 1 , wherein the dielectric material of the first isolating container has a larger band gap and a higher dielectric strength than the encapsulant.

23. The package of claim 1 , wherein the dielectric material of the first isolating container has a higher thermal conductivity than the encapsulant.

24. A semiconductor package comprising:
a glass container having a first recess thereby forming an inner membrane portion and an outer rim portion, the rim portion being thicker than the membrane portion;
a first semiconductor chip disposed in the first recess;
a first backplane disposed under the membrane portion of the glass container; and
an encapsulant disposed around the glass container, the first semiconductor chip, and the first backplane, wherein the glass container has a larger band gap and a higher dielectric strength than the encapsulant.

Assignees

• Ausserlechner Udo
• Von Koblinski Carsten
• Wabnig Sigrid
• Strutz Volker
• Grünberger Robert
• Infineon Technologies Ag

Inventors

• Ausserlechner Udo
• Von Koblinski Carsten
• Wabnig Sigrid
• Strutz Volker
• Grünberger Robert

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W76/134

  having other interconnections parallel to the conductive base · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07554

  changes in dispositions · CPC title