Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
Wafer support system for 3D packaging
US9013039B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9013039-B2 |
| Application number | US-201313959252-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 5, 2013 |
| Priority date | Aug 5, 2013 |
| Publication date | Apr 21, 2015 |
| Grant date | Apr 21, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A method for handling and supporting a device wafer during a wafer thinning process and the resulting device are provided. Embodiments include forming a plurality of solder bumps on a first surface of a substrate having a first and a second surface; removing a portion from a periphery of the first surface of the substrate; forming a temporary bonding material on a first carrier; bonding the first surface of the substrate with the temporary bonding material of the first carrier; affixing the second surface of the substrate to a second carrier; and removing the temporary bonding material.
First claim
Opening claim text (preview).
What is claimed is: 1. A method comprising: forming a plurality of solder bumps on a first surface of a substrate having a first and a second surface; removing a portion from only a periphery of the first surface of the substrate; forming a temporary bonding material on a periphery of a first carrier; bonding the first surface of the substrate with the temporary bonding material of the first carrier only along the periphery of the first surface of the substrate at the locati…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9013039B2 cover?
- A method for handling and supporting a device wafer during a wafer thinning process and the resulting device are provided. Embodiments include forming a plurality of solder bumps on a first surface of a substrate having a first and a second surface; removing a portion from a periphery of the first surface of the substrate; forming a temporary bonding material on a first carrier; bonding the fir…
- Who is the assignee on this patent?
- Globalfoundries Inc
- What technology area does this patent fall under?
- Primary CPC classification H10P72/74. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).