Metal gates for semiconductor devices and method thereof
US-2024429281-A1 · Dec 26, 2024 · US
US9013000B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9013000-B2 |
| Application number | US-201313931079-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 28, 2013 |
| Priority date | Jun 29, 2012 |
| Publication date | Apr 21, 2015 |
| Grant date | Apr 21, 2015 |
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The present disclosure relates to a semiconductor device and a method of manufacturing the same. The semiconductor device may include a first metal gate electrode provided in a NMOS region of a substrate; and a second metal gate electrode provided in a PMOS region of the substrate, wherein the first and second metal gate electrodes may be formed of TiN material or TiAlN material. Here, the first metal gate electrode may have a higher titanium (Ti) content than the second metal gate electrode, and the second metal gate electrode may have a higher nitrogen (N) content than the first metal gate electrode.
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What is claimed is: 1. A semiconductor device comprising: a first metal gate electrode provided in an NMOS region of a substrate; and a second metal gate electrode provided in a PMOS region of the substrate, wherein the first metal gate electrode are formed of TiN material or TiAlN material, wherein the first metal electrode has a higher titanium (Ti) content than the second metal gate electrode, wherein the second metal gate electrode has a higher nitrogen (N) content tha…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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