Method for forming source/drain contacts
US-2024379814-A1 · Nov 14, 2024 · US
US9012999B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9012999-B2 |
| Application number | US-201213590548-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 21, 2012 |
| Priority date | Aug 21, 2012 |
| Publication date | Apr 21, 2015 |
| Grant date | Apr 21, 2015 |
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Official abstract text for this publication.
A semiconductor device includes a semiconductor substrate having a channel region therein, a gate structure above the channel region, and source and drain regions on opposite sides of the gate structure. A respective contact is on each of the source and drain regions. At least one of the source and drain regions has an inclined upper contact surface with the respective contact. The inclined upper contact surface has at least a 50% greater area than would a corresponding flat contact surface.
Opening claim text (preview).
That which is claimed is: 1. A semiconductor device comprising: a semiconductor substrate having a channel region therein and at least one isolation region therein adjacent the channel region; a gate structure above the channel region; raised source and drain regions on opposite sides of said gate structure and having a bottom contacting said semiconductor substrate without overlapping the at least one isolation region; and a respective contact on each of said raised source…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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