Electronic device
US-2024328857-A1 · Oct 3, 2024 · US
Tiled X-ray imager panel and method of forming the same
US9012859B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9012859-B2 |
| Application number | US-201213475537-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 18, 2012 |
| Priority date | May 18, 2012 |
| Publication date | Apr 21, 2015 |
| Grant date | Apr 21, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A tiled imager panel is disclosed. In certain embodiments, the tiled imager panel is formed from separate imager chips that are mechanically tiled together so as to minimize the gap between the tiled imager chips. In addition, in certain embodiments, a scintillator material associated with the tiled imager panel is in a hermetically sealed environment so as to be protected from moisture.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for manufacturing a tiled detector panel is provided, comprising: positioning imager chips face-down in a tiled arrangement; applying an epoxy on a back surface of the imager chips at least along internal seams of the tiled arrangement of imager chips; applying a substrate to the epoxy on the back surface of the imager chips, wherein a respective unfilled space is defined for each imager chip between the substrate, the epoxy, and the back…
Assignees
Inventors
Classifications
Electricity · mapped topic
Physics · mapped topic
- G01T1/2018Primary
Physics · mapped topic
- G01T1/2006Primary
Physics · mapped topic
- G01T1/20182Primary
Physics · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9012859B2 cover?
- A tiled imager panel is disclosed. In certain embodiments, the tiled imager panel is formed from separate imager chips that are mechanically tiled together so as to minimize the gap between the tiled imager chips. In addition, in certain embodiments, a scintillator material associated with the tiled imager panel is in a hermetically sealed environment so as to be protected from moisture.
- Who is the assignee on this patent?
- Wei Ching-Yeu, Gen Electric
- What technology area does this patent fall under?
- Primary CPC classification G01T1/2018. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Apr 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).