Semiconductor device and method for forming the same
US-2024395669-A1 · Nov 28, 2024 · US
US9012286B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9012286-B2 |
| Application number | US-201213445428-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 12, 2012 |
| Priority date | Apr 12, 2012 |
| Publication date | Apr 21, 2015 |
| Grant date | Apr 21, 2015 |
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Disclosed herein are various methods of forming FinFET semiconductor devices so as to tune the threshold voltage of such devices. In one example, the method includes forming a plurality of spaced-apart trenches in a semiconducting substrate to define at least one fin (or fins) for the device, prior to forming a gate structure above the fin (or fins), performing a first epitaxial growth process to grow a first semiconductor material on exposed portions of the fin (or fins) and forming the gate structure above the first semiconductor material on the fin (or fins).
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What is claimed: 1. A method of forming a FinFET device, comprising: forming a plurality of spaced-apart trenches in a semiconducting substrate, said trenches defining at least one fin comprised of said semiconducting substrate for said device; forming a layer of insulating material in said trenches, wherein an upper portion of said at least one fin extends above an upper surface of said layer of insulating material so as to expose all sidewall surfaces and an entirety of a top…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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