Semiconductor device
US-2024421048-A1 · Dec 19, 2024 · US
Integrated circuit package including embedded thin-film battery
US9012264B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9012264-B2 |
| Application number | US-201414321422-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 1, 2014 |
| Priority date | Jun 30, 2004 |
| Publication date | Apr 21, 2015 |
| Grant date | Apr 21, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of producing an integrated circuit package, comprising: adhering a thin-film battery to a first surface of a substrate; disposing an integrated circuit die over at least a portion of the thin-film battery such that the portion of the thin-film battery is interposed between the substrate and the integrated circuit die; adhering a lead frame to one of a portion of the thin-film battery underlying the integrated circuit die and a second surface of…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9012264B2 cover?
- An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
- Who is the assignee on this patent?
- St Microelectronics Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W90/811. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).