Display apparatus and method of manufacturing the same
US-2024419215-A1 · Dec 19, 2024 · US
Method for packaging light emitting diode
US9012248B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9012248-B2 |
| Application number | US-201213612895-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 13, 2012 |
| Priority date | Jan 10, 2012 |
| Publication date | Apr 21, 2015 |
| Grant date | Apr 21, 2015 |
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- Title
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Abstract
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A method for packaging an LED includes steps: providing a substrate with a circuit structure formed thereon, stacking the substrate on a supporting board, and arranging a plurality of LED dies on the substrate; providing a mold and a gelatinous-state fluorescent film, positioning the supporting board in the mold and covering the mold with the gelatinous-state fluorescent film to cooperatively define a receiving space among the fluorescent film, the mold and the supporting board, the substrate and the LED dies being received in the receiving space; exhausting air in the receiving space to attach the gelatinous-state fluorescent film on the LED dies; solidifying the gelatinous-state fluorescent film and removing the mold; forming an encapsulation on the substrate to cover the LED dies; cutting the substrate and removing the supporting board to obtain several individual LED packages.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing an LED package, comprising steps: providing a substrate with a circuit structure formed thereon, stacking the substrate on a supporting board, and arranging a plurality of LED dies on the substrate; providing a mold and a gelatinous-state fluorescent film with a uniform thickness, positioning the supporting board with the substrate and the LED dies in the mold and positioning the gelatinous-state fluorescent film in the mold, the…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9012248B2 cover?
- A method for packaging an LED includes steps: providing a substrate with a circuit structure formed thereon, stacking the substrate on a supporting board, and arranging a plurality of LED dies on the substrate; providing a mold and a gelatinous-state fluorescent film, positioning the supporting board in the mold and covering the mold with the gelatinous-state fluorescent film to cooperatively d…
- Who is the assignee on this patent?
- Chen Lung-Hsin, Tseng Wen-Liang, Chen Pin-Chuan, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10H20/851. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).