Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
Positive resist composition and pattern forming method using the same
US9012123B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9012123-B2 |
| Application number | US-92204109-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 26, 2009 |
| Priority date | Mar 28, 2008 |
| Publication date | Apr 21, 2015 |
| Grant date | Apr 21, 2015 |
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Abstract
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A positive resist composition and a pattern forming method using the resist composition are provided, the resist composition including: (A) a resin containing a repeating structural unit represented by formula (I) as defined in the specification and being capable of decomposing by an action of an acid to increase the solubility in an alkali developer; (B) an acid generator; and (C) a mixed solvent containing at least one solvent selected from the group consisting of the following Group (a) and at least one solvent selected from the group consisting of the following Groups (b) to (d): Group (a): an alkylene glycol monoalkyl ether, Group (b): an alkylene glycol monoalkyl ether carboxylate, Group (c): a linear ketone, a branched chain ketone, a cyclic ketone, a lactone and an alkylene carbonate, and Group (d): a lactic acid ester, an acetic acid ester and an alkoxypropionic acid ester.
First claim
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The invention claimed is: 1. A positive resist composition, comprising: (A) a resin containing a repeating structural unit represented by formula (I) and being capable of decomposing by an action of an acid to increase the solubility of the resin (A) in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a mixed solvent containing at least one solvent selected from the group consisting of the following Group…
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Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
- G03F7/0397Primary
Physics · mapped topic
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Frequently asked questions
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- What does patent US9012123B2 cover?
- A positive resist composition and a pattern forming method using the resist composition are provided, the resist composition including: (A) a resin containing a repeating structural unit represented by formula (I) as defined in the specification and being capable of decomposing by an action of an acid to increase the solubility in an alkali developer; (B) an acid generator; and (C) a mixed solv…
- Who is the assignee on this patent?
- Yamamoto Kei, Shibuya Akinori, Fujifilm Corp
- What technology area does this patent fall under?
- Primary CPC classification G03F7/0397. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Apr 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).