Back grinding apparatus and wear amount measuring method using the same
US-2024424637-A1 · Dec 26, 2024 · US
US9011202B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9011202-B2 |
| Application number | US-201213456035-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 25, 2012 |
| Priority date | Apr 25, 2012 |
| Publication date | Apr 21, 2015 |
| Grant date | Apr 21, 2015 |
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A method of controlling a polishing operation includes obtaining a sequence over time of measured spectra with an in-situ optical monitoring system during polishing. For each measured spectrum from the sequence an optical model is fit. The optical model includes dimensions of a repeating structure and the fitting includes calculating a output spectrum using diffraction effects of the repeating structure, and parameters of the optical model include an endpoint parameter and a parameter of the repeating structure. The fitting generates the sequence of fitted endpoint parameter values, and at least one of a polishing endpoint or an adjustment of a pressure to the substrate is determined from the sequence of fitted endpoint parameter values.
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What is claimed is: 1. A method of controlling a polishing operation, comprising: polishing a first layer of a substrate; during polishing, obtaining a sequence over time of measured spectra with an in-situ optical monitoring system; for each measured spectrum from the sequence of measured spectra, fitting an optical model to the measured spectrum, the fitting including finding parameters that provide a minimum difference between an output spectrum of the optical model and the…
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