Method and system for determining and dispensing resin for a compression molding process flow

US9011127B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9011127-B2
Application numberUS-201213586749-A
CountryUS
Kind codeB2
Filing dateAug 15, 2012
Priority dateAug 15, 2012
Publication dateApr 21, 2015
Grant dateApr 21, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure is directed to a system and method for forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier. The forming includes providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier. The providing includes accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium, determining the quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier, and molding the unpackaged dice into the packaged dice using the quantity of molding compound.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method, comprising: forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier, the forming including: providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier, the providing including: accessing the indication of the total number of the unpackaged dice on the carrie…

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Frequently asked questions

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What does patent US9011127B2 cover?
The present disclosure is directed to a system and method for forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier. The forming includes providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier. The providi…
Who is the assignee on this patent?
Carino Wiljee, Ang Bernie Chrisanto, Laylo Richard, and 1 more
What technology area does this patent fall under?
Primary CPC classification B29C43/58. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).