Method of forming metallic pattern on polymer substrate
US-2015366072-A1 · Dec 17, 2015 · US
Electronic apparatus and hard disk drive
US9007779B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9007779-B2 |
| Application number | US-201213358432-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 25, 2012 |
| Priority date | Mar 29, 2010 |
| Publication date | Apr 14, 2015 |
| Grant date | Apr 14, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic apparatus comprising: a case; a printed circuit board contained in the case and comprising a through-hole; a fixing member comprising a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion, and configure to fix the printed circuit board and the case to each other, and to be electrically connected with the case; a copper foil provided on the printed circuit board; a cover film covering at…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H05K1/0215Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Physics · mapped topic
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Frequently asked questions
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- What does patent US9007779B2 cover?
- According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an…
- Who is the assignee on this patent?
- Yamamoto Nobuhiro, Funayama Takahisa, Toshiba Kk
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0215. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 14 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).