Radio-frequency transmission line structures for wireless circuitry based on conductive traces on multiple printed circuits
US-12021290-B2 · Jun 25, 2024 · US
High-frequency signal transmission line and electronic apparatus
US9007151B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9007151-B2 |
| Application number | US-201414151871-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 10, 2014 |
| Priority date | Dec 3, 2010 |
| Publication date | Apr 14, 2015 |
| Grant date | Apr 14, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic apparatus comprising a first article, a second article and a high-frequency signal transmission line, the high-frequency signal transmission line comprising: an element assembly including one or more insulating layers, and a first main surface and a second main surface; a linear signal line disposed in the element assembly; a first ground conductor that faces the signal line at a first distance and continuously extends along the signal line…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H05K1/025Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9007151B2 cover?
- An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along t…
- Who is the assignee on this patent?
- Murata Manufacturing Co
- What technology area does this patent fall under?
- Primary CPC classification H05K1/025. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 14 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).