Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Thin power device and preparation method thereof
US9006901B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9006901-B2 |
| Application number | US-201313946949-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 19, 2013 |
| Priority date | Jul 19, 2013 |
| Publication date | Apr 14, 2015 |
| Grant date | Apr 14, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A thin power device comprises a substrate having a first set of first contact pads at a front surface of the substrate electrically connecting to a second set of second contact pads at a back surface of the substrate, a through opening opened from the front surface and through the substrate exposing a third contact pad at the back surface of the substrate, a semiconductor chip embedded into the through opening with a back metal layer at a back surface of the semiconductor chip attached on the third contact pad, and a plurality of conductive structures electrically connecting electrodes at a front surface of the semiconductor chip with the corresponding first contact pads in the first sets of first contact pads.
First claim
Opening claim text (preview).
The invention claimed is: 1. A thin power device comprising: a substrate having a first set of first contact pads arranged at a front surface of the substrate and a second set of second contact pads arranged at a back surface of the substrate, wherein each first contact pad in the first set of contact pads being electrically connected with a second contact pad in the second set of contact pads; a through opening opened from the front surface and through the substrate thus exposi…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9006901B2 cover?
- A thin power device comprises a substrate having a first set of first contact pads at a front surface of the substrate electrically connecting to a second set of second contact pads at a back surface of the substrate, a through opening opened from the front surface and through the substrate exposing a third contact pad at the back surface of the substrate, a semiconductor chip embedded into the…
- Who is the assignee on this patent?
- Gong Yuping, Xue Yan Xun, Lu Ming-Chen, and 4 more
- What technology area does this patent fall under?
- Primary CPC classification H10W70/68. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 14 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).