Interposer instrumentation method and apparatus
US-2024133947-A1 · Apr 25, 2024 · US
Tj temperature calibration, measurement and control of semiconductor devices
US9006000B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9006000-B2 |
| Application number | US-201213463056-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 3, 2012 |
| Priority date | May 3, 2012 |
| Publication date | Apr 14, 2015 |
| Grant date | Apr 14, 2015 |
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Abstract
Official abstract text for this publication.
A semiconductor device, such as a semiconductor die, is disclosed including embedded temperature sensors for scanning the junction temperature, Tj, at one or more locations of the semiconductor die while the die is operating. Once a temperature of a hot spot is detected that is above a temperature specified for the die or package containing the die, the die/package may be discarded. Alternatively, the functionality of the die may be altered in a way that reduces the temperature of the hot spots.
First claim
Opening claim text (preview).
We claim: 1. A method of providing a first semiconductor die in a semiconductor package, comprising: (a) embedding a plurality of temperature sensors within the first semiconductor die; (b) scanning one or more of the plurality of temperature sensors within the first semiconductor die while the semiconductor die first is operating to determine whether a temperature at one or more locations of the operating first semiconductor die exceed a predetermined temperature; (c) determi…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Physics · mapped topic
- G01R31/2884Primary
Physics · mapped topic
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Frequently asked questions
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- What does patent US9006000B2 cover?
- A semiconductor device, such as a semiconductor die, is disclosed including embedded temperature sensors for scanning the junction temperature, Tj, at one or more locations of the semiconductor die while the die is operating. Once a temperature of a hot spot is detected that is above a temperature specified for the die or package containing the die, the die/package may be discarded. Alternative…
- Who is the assignee on this patent?
- Hanan Deny, Redmard Eddie, Dror Itai, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification G01R31/2884. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Apr 14 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).