Drive apparatus having a motor, a heat sink, and a plurality of semiconductor modules

Patent metadata

Field	Value
Publication number	US-9000633-B2
Application number	US-201013379096-A
Country	US
Kind code	B2
Filing date	Jun 23, 2010
Priority date	Jun 24, 2009
Publication date	Apr 7, 2015
Grant date	Apr 7, 2015

Abstract

A heat sink has two heat radiation blocks. The heat radiation block is formed in a wide column shape. The heat radiation block has connection parts at both ends. The connection parts have respective holes formed to pass through in the axial direction of a motor. One screw is inserted in one connection part and threaded into a motor case. The other screw is inserted in the other connection part and threaded into the motor case together with a cover. A power module forming an inverter circuit of each of two power supply systems is arranged on each heat radiation blocks.

First claim

The invention claimed is:

1. A drive apparatus comprising:
a motor having a motor case formed in a cylindrical shape to define an outer periphery, a stator located radially inside the motor case and wound with winding wires to provide a plurality of phases corresponding to a U-phase, V-phase, and W-phase, a rotor located radially inside the stator and rotatable relative to the stator, and a shaft rotatable together with the rotor;
a heat sink arranged in an axial direction of the motor case and having a plurality of column-shaped parts spaced apart from one another; and
a plurality of semiconductor modules provided for a plurality of power supply systems, each of which switches over coil currents for the plurality of phases corresponding to a U-phase, V-phase, and W-phase supplied to the winding wires by a plurality of switching elements, and arranged on the plurality of column-shaped parts such that one power supply system corresponds to one column-shaped part,
wherein a part of the plurality of semiconductor modules forming the one power supply system is arranged on the one column-shaped part corresponding to the one power supply system;
the heat sink has a first column-shaped part and a second column-shaped part, as the plurality of column-shaped parts;
the plurality of power supply systems has a first power supply system and a second power supply system in correspondence to the first column-shaped part and the second column-shaped part, respectively;
the plurality of semiconductor modules has a first part of semiconductor modules forming the first power supply system and a second part of semiconductor modules forming the second power supply system; and
all the first part of semiconductor modules and all the second part of semiconductor modules are provided on the first column-shaped part and the second column-shaped part, respectively.

2. The drive apparatus according to claim 1 , wherein:
each of the column-shaped parts is formed in a thick plate shape having a predetermined thickness in a radial direction.

3. The drive apparatus according to claim 2 , wherein:
each of the column-shaped parts has connection parts at respective end parts, the connection parts having fixing holes provided in the axial direction.

4. The drive apparatus according to claim 3 , wherein:
the heat sink has a connection part formed in a plate shape for connecting the column-shaped parts in parallel.

5. The drive apparatus according to claim 3 , wherein:
the first column-shaped part and the second column-shaped parts are provided in parallel and symmetrically relative to a center of the shaft as a reference.

6. The drive apparatus according to claim 5 , wherein:
each of the first part of semiconductor modules and the second part of semiconductor modules is formed as a single module, which is arranged on a surface of each of the column-shaped parts.

7. The drive apparatus according to claim 6 , wherein:
the first part of semiconductor modules and the second part of semiconductor modules are arranged such that arrangement of respective terminals protruding in the axial direction are in line-symmetry and point-symmetry relative to a center of the shaft as a reference when viewed in the axial direction.

8. The drive apparatus according to claim 5 , wherein:
each of the first part of semiconductor modules and the second part of semiconductor modules contacts two adjacent surfaces of the first column-shaped part and the second column-shaped parts, respectively.

9. The drive apparatus according to claim 1 , wherein:
the heat sink has a connection part for connecting the column-shaped parts.

10. The drive apparatus according to claim 1 , wherein:
the first column-shaped part and the second column-shaped part are provided in parallel and symmetrically relative to a center of the shaft as a reference.

11. The drive apparatus according to claim 10 , wherein:
each of the first part of semiconductor modules and the second part of semiconductor modules is formed as a single module, which is arranged on a surface of each of the column-shaped parts.

12. The drive apparatus according to claim 11 , wherein:
the first part of semiconductor modules and the second part of semiconductor modules are arranged such that arrangement of respective terminals protruding in the axial direction are in line-symmetry relative to a center of the shaft as a reference when viewed in the axial direction.

13. The drive apparatus according to claim 12 , wherein:
the first part of semiconductor modules and the second part of semiconductor modules are arranged such that arrangement of the respective terminals protruding in the axial direction are in point-symmetry relative to the center of the shaft as a reference when viewed in the axial direction.

14. The drive apparatus according to claim 11 , wherein:
each of the first part of semiconductor modules and the second part of semiconductor modules contacts two adjacent surfaces of the first column-shaped part and the second column-shaped part, respectively.

15. The drive apparatus according to claim 1 , further comprising:
capacitors and a coil are arranged radially inside the column-shaped parts.

Assignees

• Yamasaki Masashi
• Furumoto Atsushi
• Kabune Hideki
• Denso Corp

Inventors

• Yamasaki Masashi
• Furumoto Atsushi
• Kabune Hideki

Classifications

• H02K5/225

  Terminal boxes or connection arrangements (specially adapted for submersible motors H02K5/132) · CPC title

• H02K2211/03

  Machines characterised by circuit boards, e.g. pcb · CPC title

• B62D5/0406

  including housing for electronic control unit · CPC title

• H02K11/0073 Primary

  Electricity · mapped topic

• H02K11/33 Primary

  Drive circuits, e.g. power electronics (H02K11/38 takes precedence) · CPC title