Memory cell with reduced parasitic capacitance and method of manufacturing the same
US-2024334680-A1 · Oct 3, 2024 · US
US9000511B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9000511-B2 |
| Application number | US-201213529621-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 21, 2012 |
| Priority date | Jun 21, 2011 |
| Publication date | Apr 7, 2015 |
| Grant date | Apr 7, 2015 |
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A non-volatile memory device includes a substrate having an active region defined by a device isolation region that has a trench and an air gap, a device isolation pattern positioned at a lower portion of the trench, a memory cell layer including a tunnel insulation layer, a trap insulation layer and a blocking insulation layer that are sequentially stacked on the active region and one of which extends from the active region toward the device isolation region encloses top of the air gap whose bottom is defined by a layer other than that of the top, and a control gate electrode positioned on the cell structure. The one of the insulation layer extending includes a recess at a region corresponding to the center of the air gap.
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What is claimed is: 1. A non-volatile memory device comprising: a substrate having an active region defined by a device isolation region, the device isolation region having a trench and an air gap, a sidewall of the trench being straight from a top to a bottom of the trench such that a width of the trench decreases with increasing depth; a device isolation pattern positioned at a lower portion of the trench such that the air gap is positioned at an upper portion of the trench co…
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