Elongated via structures

Patent metadata

Field	Value
Publication number	US-8999846-B2
Application number	US-201414255037-A
Country	US
Kind code	B2
Filing date	Apr 17, 2014
Priority date	Apr 30, 2012
Publication date	Apr 7, 2015
Grant date	Apr 7, 2015

Abstract

An integrated circuit structure includes a plurality of insulator layers (connected to each other) that form a laminated structure. Further included are via openings within each of the insulator layers, and conductive via material within the via openings. The conductive via material within corresponding via openings of adjacent insulator layers are electrically connected to form continuous electrical via paths through the insulator layers between the top surface and the bottom surface of the laminated structure. Within each of the continuous electrical via paths, the via openings are positioned relative to each other to form a diagonal structural path of the conductive via material through the laminated structure. The corresponding via openings of the adjacent insulator layers partially overlap each other. The diagonal structural paths are non-perpendicular to the top surface and the bottom surface.

First claim

What is claimed is:

1. A method of forming an integrated circuit structure comprising:
forming via openings in an insulator layer;
forming conductive via material within said via openings; and
forming a laminated structure of insulator layers on said insulator layer, said forming of said laminated structure of insulator layers comprising:
successively forming said insulator layers on one another;
repeating said forming of said via openings in each said insulator layers;
p…

Assignees

• IBM

Inventors

• Lacroix Luke D
• Lamorey Mark C H
• Patel Janak G
• Slota Jr Peter
• Stone David B

Classifications

• H10W20/435

  Electricity · mapped topic

• H10W20/42 Primary

  Electricity · mapped topic

• H10W20/01 Primary

  Electricity · mapped topic

• H01L23/5226

  Electricity · mapped topic

• H01L23/5283

  Electricity · mapped topic