Manufacturing method of GaN-based semiconductor device and semiconductor device

US8999788B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8999788-B2
Application numberUS-201313950079-A
CountryUS
Kind codeB2
Filing dateJul 24, 2013
Priority dateJan 25, 2011
Publication dateApr 7, 2015
Grant dateApr 7, 2015

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Abstract

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Provided is a method of manufacturing a gallium-nitride-based semiconductor device, comprising forming a first semiconductor layer of a gallium-nitride-based semiconductor; and forming a recessed portion by dry etching a portion of the first semiconductor layer via a microwave plasma process using a bromine-based gas.

First claim

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What is claimed is: 1. A method of manufacturing a gallium-nitride-based semiconductor device, comprising: forming a first semiconductor layer of a gallium-nitride-based semiconductor; forming a recessed portion by dry etching a portion of the first semiconductor layer by a microwave plasma process using a bromine-based gas; forming a first sacrificial layer that contacts the first semiconductor layer and has a higher solid solubility for impurities included in the first semic…

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What does patent US8999788B2 cover?
Provided is a method of manufacturing a gallium-nitride-based semiconductor device, comprising forming a first semiconductor layer of a gallium-nitride-based semiconductor; and forming a recessed portion by dry etching a portion of the first semiconductor layer via a microwave plasma process using a bromine-based gas.
Who is the assignee on this patent?
Univ Tohoku, Furukawa Electric Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P50/642. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).