Semiconductor structure with gate-all-around devices and stacked finfet devices
US-2024186187-A1 · Jun 6, 2024 · US
US8999769B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8999769-B2 |
| Application number | US-201213552607-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 18, 2012 |
| Priority date | Jul 18, 2012 |
| Publication date | Apr 7, 2015 |
| Grant date | Apr 7, 2015 |
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Official abstract text for this publication.
A method of forming a device is disclosed. A substrate defined with a device region is provided. A gate having an upper and a lower portion is formed in a trench in the substrate in the device region. The upper portion forms a gate electrode and the lower portion forms a gate field plate. First and second surface doped regions are formed adjacent to the gate. The gate field plate introduces vertical reduced surface (RESURF) effect in a drift region of the device.
Opening claim text (preview).
What is claimed is: 1. A method of forming a device comprising: providing a substrate defined with a device region, wherein the device region comprises a first polarity type first doped well; forming a gate having an upper and a lower portion in a trench in the substrate, wherein the upper portion forms a gate electrode and the lower portion forms a gate field plate; forming second and third doped wells disposed within the first doped well, wherein the second doped well compr…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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