Display substrate, display panel, and display apparatus
US-2024411399-A1 · Dec 12, 2024 · US
US8999750B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8999750-B2 |
| Application number | US-201313919615-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 17, 2013 |
| Priority date | Dec 5, 2008 |
| Publication date | Apr 7, 2015 |
| Grant date | Apr 7, 2015 |
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A semiconductor device includes an oxide semiconductor layer provided over a substrate having an insulating surface; a gate insulating film covering the oxide semiconductor layer; a first conductive layer and a second conductive layer laminated in this order over the gate insulating film; an insulating film covering the oxide semiconductor layer and a gate wiring including a gate electrode (the first and second conductive layers); and a third conductive layer and a fourth conductive layer laminated in this order over the insulating film and electrically connected to the oxide semiconductor layer. The gate electrode is formed using the first conductive layer. The gate wiring is formed using the first conductive layer and the second conductive layer. A source electrode is formed using the third conductive layer. A source wiring is formed using the third conductive layer and the fourth conductive layer.
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing a semiconductor device comprising the steps of: forming an oxide semiconductor film over a substrate; forming a silicon nitride film over the oxide semiconductor film; forming a silicon oxide film over the silicon nitride film; removing part of the silicon oxide film; forming a conductive film having a light-transmitting property over the silicon oxide film; forming a resist mask using a multi-tone mask over the oxide sem…
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
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