Display apparatus and method of manufacturing the same
US-2024419215-A1 · Dec 19, 2024 · US
Method of making molded LED package
US8999737B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8999737-B2 |
| Application number | US-201314031751-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 19, 2013 |
| Priority date | Aug 27, 2013 |
| Publication date | Apr 7, 2015 |
| Grant date | Apr 7, 2015 |
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Abstract
Official abstract text for this publication.
Methods of packaging a light emitting diode (LED) include providing a first lead having a first recess in a bottom surface and a second lead having a second recess in a bottom surface, placing a LED die over a top surface of at least one of the first and the second leads, electrically connecting the LED die to the first lead and to the second lead, forming a package around the LED die that includes an opening in its upper surface exposing at least the LED die, and separating the package containing the LED die, the first lead and the second lead from a lead frame such that the package contains a first castellation and a second castellation in a side surface of the package, such that the castellations expose the leads and/or a first platable metal which is electrically connected to the leads.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of packaging a light emitting diode (LED), comprising: providing a lead frame comprising a first lead having a first recess in a bottom surface and a second lead having a second recess in a bottom surface; placing a LED die over a top surface of at least one of the first and the second leads; electrically connecting the LED die to the first lead and to the second lead; forming a package around the LED die, the first lead and the second lead, t…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8999737B2 cover?
- Methods of packaging a light emitting diode (LED) include providing a first lead having a first recess in a bottom surface and a second lead having a second recess in a bottom surface, placing a LED die over a top surface of at least one of the first and the second leads, electrically connecting the LED die to the first lead and to the second lead, forming a package around the LED die that incl…
- Who is the assignee on this patent?
- Glo Ab
- What technology area does this patent fall under?
- Primary CPC classification H10H20/01. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).