Automated application of cut thermal adhesive films
US-9823642-B1 · Nov 21, 2017 · US
Coating layer for cutting tools
US8999532B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8999532-B2 |
| Application number | US-201113695886-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 8, 2011 |
| Priority date | Jun 3, 2011 |
| Publication date | Apr 7, 2015 |
| Grant date | Apr 7, 2015 |
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Abstract
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Provided is a coating layer for cutting tools, as a hard coating layer stacked and formed in the sequence of a TiN layer, a TiCN layer, a bonding layer, an alumina (Al 2 O 3 ) layer, and a cover layer from the bottom by using a chemical vapor deposition (CVD) method on a parent material, able to improve cutting performance, because surface residual stress of the coating layer may be maintained in a compressive stress state by adjusting a composition of the cover layer without using a separate additional process, such as a blasting operation, or a mixed process of CVD and physical vapor deposition (PVD), and simultaneously the cover layer may also be used as a wear-resistant layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. A coating layer for cutting tools formed on a surface of a parent material by using a chemical vapor deposition (CVD) method comprising: an alumina layer formed of an α-phase, disposed on the parent material and composed of a composite structure having a columnar crystal structure and an equiaxed crystal structure mixed therein; and a cover layer formed of Al x Ti y Si z Cr w N (herein, x+y+z+w=1, x≧0.75, y≧0.2, 0≦z≦0.06, 0≦w≦0.08) and disposed on th…
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Frequently asked questions
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- What does patent US8999532B2 cover?
- Provided is a coating layer for cutting tools, as a hard coating layer stacked and formed in the sequence of a TiN layer, a TiCN layer, a bonding layer, an alumina (Al 2 O 3 ) layer, and a cover layer from the bottom by using a chemical vapor deposition (CVD) method on a parent material, able to improve cutting performance, because surface residual stress of the coating layer may be maintained …
- Who is the assignee on this patent?
- Cho Seong Woo, Kim Han Sung, Lee Dong Youl, and 5 more
- What technology area does this patent fall under?
- Primary CPC classification B26D7/00. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Apr 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).