Thermoplastic resin composition and molded article
US-12098241-B2 · Sep 24, 2024 · US
Direct overmolding
US8999433B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8999433-B2 |
| Application number | US-201013260736-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 24, 2010 |
| Priority date | Apr 2, 2009 |
| Publication date | Apr 7, 2015 |
| Grant date | Apr 7, 2015 |
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Abstract
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Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components.
First claim
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What is claimed is: 1. Curable composition comprising a) an epoxy resin b) a filler composition comprising i) wollastonite having an average particle size (d 50 ) from 2 to 50 μm and ii) amorphous silica and c) a polyester anhydride hardener obtained from the reaction of a dianhydride and a less equimoloar amount of a diol comprising polyethylene glycol wherein at least one of the fillers of the filler composition is surface treated with a silane and the weight ratio of…
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Frequently asked questions
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- What does patent US8999433B2 cover?
- Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components.
- Who is the assignee on this patent?
- Beisele Christian, Grindling Josef, Baer Daniel, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification C08K3/34. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Apr 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).