Apparatus for forming thin film

US8999064B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8999064-B2
Application numberUS-201113179463-A
CountryUS
Kind codeB2
Filing dateJul 8, 2011
Priority dateAug 2, 2010
Publication dateApr 7, 2015
Grant dateApr 7, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A thin film forming apparatus according to the embodiment includes a plurality of vapor deposition sources respectively separated from each other, a plurality of nozzle bodies connected to upper portions of the respective vapor deposition sources, and a plurality of nozzles connected to upper portions of the respective nozzle bodies. A nozzle hole of each of the nozzles is formed on a same vapor deposition line. Thus, according to the embodiment, the first organic material and the second organic material respectively sprayed through a first nozzle hole and a second nozzle hole can be uniformly mixed by disposing the first nozzle hole and the second nozzle on the same vapor deposition line.

First claim

Opening claim text (preview).

What is claimed is: 1. A thin film forming apparatus comprising: a plurality of vapor deposition sources separated from each other; a plurality of nozzle bodies connected to upper portions of the vapor deposition sources; and a plurality of nozzles connected to upper portions of the nozzle bodies, wherein a nozzle hole of each of the nozzles is formed on a same vapor deposition line, and wherein each of the nozzle holes is the same size to uniformly mix a plurality of orga…

Assignees

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Classifications

  • Chemistry & Metallurgy · mapped topic

  • C23C14/243Primary

    Chemistry & Metallurgy · mapped topic

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What does patent US8999064B2 cover?
A thin film forming apparatus according to the embodiment includes a plurality of vapor deposition sources respectively separated from each other, a plurality of nozzle bodies connected to upper portions of the respective vapor deposition sources, and a plurality of nozzles connected to upper portions of the respective nozzle bodies. A nozzle hole of each of the nozzles is formed on a same vapo…
Who is the assignee on this patent?
Lee Sang-Woo, Samsung Display Co Ltd
What technology area does this patent fall under?
Primary CPC classification C23C14/243. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).