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Heat-dissipating unit having a hydrophilic compound film and method for depositing a hydrophilic compound film
US8997840B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8997840-B2 |
| Application number | US-201113045772-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 11, 2011 |
| Priority date | Mar 11, 2011 |
| Publication date | Apr 7, 2015 |
| Grant date | Apr 7, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A heat-dissipating unit having a hydrophilic compound film and a method for depositing a hydrophilic compound film are disclosed. The heat-dissipating unit includes a metallic body having a chamber and a working fluid. The chamber has a liquid-guiding structure constituted of an evaporating portion, a condensing portion and a connecting portion. At least one hydrophilic compound film is coated on surfaces of the chamber and the liquid-guiding structure. By this arrangement, the flowing of the working fluid in the heat-dissipating unit is enhanced to improve the heat-conducting efficiency of the heat-dissipating unit.
First claim
Opening claim text (preview).
What is claimed is: 1. A heat-dissipating unit having a hydrophilic compound film, including a metallic body having a chamber and a working fluid, the chamber having: an evaporating portion provided in the chamber, the evaporating portion having a plurality of first liquid-guiding portions, each first liquid-guiding portion being constituted of a plurality of elongate first liquid-guiding bodies arranged at intervals and extending in a first direction in a major plane of the evap…
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Electricity · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
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- What does patent US8997840B2 cover?
- A heat-dissipating unit having a hydrophilic compound film and a method for depositing a hydrophilic compound film are disclosed. The heat-dissipating unit includes a metallic body having a chamber and a working fluid. The chamber has a liquid-guiding structure constituted of an evaporating portion, a condensing portion and a connecting portion. At least one hydrophilic compound film is coated …
- Who is the assignee on this patent?
- Yang Hsiu-Wei, Asia Vital Components Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B05D5/04. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Apr 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).