Thin heat pipe structure and method of manufacturing same

US8997839B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8997839-B2
Application numberUS-201113043484-A
CountryUS
Kind codeB2
Filing dateMar 9, 2011
Priority dateJan 18, 2011
Publication dateApr 7, 2015
Grant dateApr 7, 2015

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.

First claim

Opening claim text (preview).

What is claimed is: 1. A heat pipe structure, comprising: a pipe body having a flat shape, and including a first side and an opposite second side as well as a first closed end and an opposite second closed end to define a receiving space in the pipe body; and a working fluid being provided in the receiving space; a sheet member being arranged in the receiving space of the pipe body, and including a plurality of first extended sections and a plurality of second extended sections,…

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What does patent US8997839B2 cover?
A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at th…
Who is the assignee on this patent?
Yang Hsiu-Wei, Weng Ming-Tai, Asia Vital Components Co Ltd
What technology area does this patent fall under?
Primary CPC classification B23P15/26. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).