High impact resistant acceleration sensor

US8997570B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8997570-B2
Application numberUS-201113253398-A
CountryUS
Kind codeB2
Filing dateOct 5, 2011
Priority dateMay 13, 2008
Publication dateApr 7, 2015
Grant dateApr 7, 2015

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Abstract

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An acceleration sensor having a high impact resistance to prevent breakage under excessive acceleration, but can stably exert a sensing performance. The acceleration sensor is formed of an SOI substrate of a three-layered structure including a silicon layer (active layer silicon), a silicon oxide layer, and a silicon layer (substrate silicon). The acceleration sensor includes frame parts, a plurality of beam parts, the beam parts projecting inward from the frame part, and a weight part supported by the beam parts. A strain sensing part is provided on each of the beam parts. A width W of each of the beam parts, a length I of each of the beam parts, and an inner frame length L of the frame part satisfy the following relationships of Expressions (1) and (2). 2< L/I ≦2.82  Expression (1) I/W ≦3.68  Expression (2)

First claim

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I claim: 1. An acceleration sensor formed of an SOI substrate of a three-layered structure including an active silicon layer, a silicon oxide layer, and a silicon substrate, the acceleration sensor comprising: a frame part; a plurality of beam parts, the beam parts projecting inward from the frame part; and a weight part supported by the beam parts; wherein: each of the beam parts is provided with a strain sensing part; and a width W of each of the beam parts, a length I…

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What does patent US8997570B2 cover?
An acceleration sensor having a high impact resistance to prevent breakage under excessive acceleration, but can stably exert a sensing performance. The acceleration sensor is formed of an SOI substrate of a three-layered structure including a silicon layer (active layer silicon), a silicon oxide layer, and a silicon layer (substrate silicon). The acceleration sensor includes frame parts, a plu…
Who is the assignee on this patent?
Maekawa Shinji, Dainippon Printing Co Ltd
What technology area does this patent fall under?
Primary CPC classification G01P15/18. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).