Micromachined gyroscope with detection in the plane of the machined wafer

US8997568B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8997568-B2
Application numberUS-201013381358-A
CountryUS
Kind codeB2
Filing dateMay 28, 2010
Priority dateJun 30, 2009
Publication dateApr 7, 2015
Grant dateApr 7, 2015

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Abstract

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A gyroscope having a vibrating structure, produced by micromachining in a thin planar wafer, the gyroscope including two symmetrical moving assemblies that are coupled by a coupling structure connecting the two assemblies so as to allow mechanical vibration energy to be transferred between them, each moving assembly including a first moving element connected to the coupling structure and able to vibrate with two degrees of freedom in orthogonal directions Ox and Oy of the plane of the wafer, and a second moving element adjacent the first moving element, capable of vibrating only in the Oy direction and connected to the first moving element via linkage element, wherein the linkage element allow the transmission, in phase opposition, to the second moving element of the vibration movement of the first moving element in the Oy direction.

First claim

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The invention claimed is: 1. A gyroscope having a vibrating structure, produced by micromachining in a thin planar wafer, said gyroscope comprising: two symmetrical moving assemblies coupled by a coupling structure connecting the two moving assemblies so as to allow mechanical vibration energy to be transferred between said two moving assemblies, each moving assembly comprising a first moving element connected to the coupling structure and able to vibrate with two degrees of free…

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What does patent US8997568B2 cover?
A gyroscope having a vibrating structure, produced by micromachining in a thin planar wafer, the gyroscope including two symmetrical moving assemblies that are coupled by a coupling structure connecting the two assemblies so as to allow mechanical vibration energy to be transferred between them, each moving assembly including a first moving element connected to the coupling structure and able t…
Who is the assignee on this patent?
Leverrier Bertrand, Thales Sa
What technology area does this patent fall under?
Primary CPC classification G01C19/5747. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).