Crimp die set

US8997543B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8997543-B2
Application numberUS-201414209311-A
CountryUS
Kind codeB2
Filing dateMar 13, 2014
Priority dateMar 15, 2013
Publication dateApr 7, 2015
Grant dateApr 7, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A die set for crimping operations includes first and second die members having raised areas including a plurality of knurls and character areas. The die set combining knurls and character areas on the operative areas of the die members allows a single die set to be used to condition a surface for crimping operations as well as crimping connectors and marking them with relevant indicia without having to change die sets.

First claim

Opening claim text (preview).

I claim: 1. A die set for crimping operations comprising: a first die member comprising a die body having an operative surface; said operative surface having a plurality of knurl members and character areas defining a reference character between said knurl members. 2. The die set of claim 1 , wherein said character areas comprise a ridge. 3. The die set of claim 2 , wherein said knurl members and said ridge have the same height. 4. The die set of claim 1 , further comprising a second die member having an operative surface and a plurality of knurl members disposed on said operative surface, wherein said knurl members of said second die member include character ridges defining a reference character. 5. The die set of claim 4 , wherein said reference characters of said first and second die members define the same reference character. 6. The die set of claim 4 , wherein said reference characters of said first and second die members comprise a die index number. 7. The die set of claim 1 , further comprising a second die member; each of said first and second die members having a substantially semi-cylindrical body including a rounded side and a flat side; said rounded side configured to be operatively engaged in a crimp tool; and, said flat side including a raised platform defining said operative surface and including said knurl members and character areas. 8. The die set of claim 7 , wherein said die set is received in a crimp tool and operative to condition a surface for crimping and for crimping a connector to said conditioned surface while also embossing a die index number on said connector. 9. The die set of claim 8 , wherein said knurl members are generally pyramid shaped. 10. The die set of claim 1 , wherein said character areas are recesses defined by said knurl members surrounding said character areas. 11. The die set of claim 1 , wherein said character areas are recesses in said operative surface. 12. The die set of claim 2 , wherein said ridge of said character area has a length greater than a length of said knurl members. 13. The die set of claim 2 , wherein said ridge of said character area has a width greater than a width of said knurl members. 14. The die set of claim 2 , wherein said at least one reference character of said first and second die members comprises a plurality of characters. 15. The die set of claim 14 , wherein said plurality of characters is a die index number. 16. A method of crimping workpieces together comprising: loading a crimp tool having opposing jaws with die members including opposing operative surface having a plurality of knurl members and character areas; positioning a portion of a substrate between the jaws of the crimp tool and between the operative surfaces of the die members; actuating the crimp tool to close the jaws and engage the operative surfaces of said die members to condition a surface of said substrate; opening the jaws and inserting a connector body and wire member into engagement with said substrate; actuating the crimp tool a second time to crimp the connector body and wire member to said substrate, whereby said crimping leaves a mirror-image of said character areas on said connector body. 17. A kit for crimping operations comprising: a plurality of die sets each said die sets being sized to a die index value and configured to include said index value on an operative area of at least one of said die set members, whereby use of said die sets results in the index value of said die sets being left on a workpiece, each said die set having a first die member and a second die member, said first die member having an operative surface with a character area corresponding to the die index value. 18. The kit of claim 17 , wherein said operative surface of said first die members include knurl members defining said character area between said knurl members. 19. The kit of claim 18 , wherein said second die member has an operative surface with a plurality of knurl members defining a character area on said second die member between said knurl members on said second die member.

Assignees

Inventors

Classifications

  • B21D37/10Primary

    Die sets; Pillar guides · CPC title

  • B25B27/10Primary

    inserting fittings into hoses · CPC title

  • Hand tools for crimping · CPC title

  • Photovoltaic [PV] energy · CPC title

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Frequently asked questions

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What does patent US8997543B2 cover?
A die set for crimping operations includes first and second die members having raised areas including a plurality of knurls and character areas. The die set combining knurls and character areas on the operative areas of the die members allows a single die set to be used to condition a surface for crimping operations as well as crimping connectors and marking them with relevant indicia without h…
Who is the assignee on this patent?
Hubbell Inc
What technology area does this patent fall under?
Primary CPC classification B21D37/10. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).