Electronic package module and method for fabrication of the same
US-2024413067-A1 · Dec 12, 2024 · US
Method for manufacturing interposer
US8997344B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8997344-B2 |
| Application number | US-201113183782-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 15, 2011 |
| Priority date | Dec 28, 2007 |
| Publication date | Apr 7, 2015 |
| Grant date | Apr 7, 2015 |
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Abstract
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A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer, and removing the supporting substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing an interposer comprising: forming a first insulating layer comprising an inorganic material on a supporting substrate; forming a first wire in the first insulating layer; forming a second insulating layer on a first side of the first insulating layer; forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer; removing the supporting substrate; forming a thir…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
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- What does patent US8997344B2 cover?
- A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating lay…
- Who is the assignee on this patent?
- Sakamoto Hajime, Kawano Shuichi, Komatsu Daiki, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10W70/05. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).