Fitting assembly evaluating apparatus and methods

US8997325B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8997325-B2
Application numberUS-201013201936-A
CountryUS
Kind codeB2
Filing dateFeb 22, 2010
Priority dateFeb 20, 2009
Publication dateApr 7, 2015
Grant dateApr 7, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present application discloses methods and apparatus for installing fitting components, such as a conduit gripping device, on a conduit to form an assembly. The assembly is joinable with at least one other fitting component to form a fitting. The present application also discloses methods and apparatus for evaluating characteristics of components of a mechanically attached connection. Characteristics that may be evaluated include, but are not limited to, the position of a conduit gripping device on a conduit, an amount of axial compression or stroke of the conduit gripping device, an amount of clamping force applied to the conduit gripping device as the conduit gripping device is compressed, and an amount of torque applied to members that compresses the conduit gripping device.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of assembling a fitting comprising: applying a predetermined torque between a first fitting component and a member to axially advance the first fitting component with respect to the member to pre-install a conduit gripping device onto a conduit with a first amount of compression so that the conduit gripping device grips the conduit; separating the first fitting component from the member; assembling the first fitting component with a second…

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What does patent US8997325B2 cover?
The present application discloses methods and apparatus for installing fitting components, such as a conduit gripping device, on a conduit to form an assembly. The assembly is joinable with at least one other fitting component to form a fitting. The present application also discloses methods and apparatus for evaluating characteristics of components of a mechanically attached connection. Charac…
Who is the assignee on this patent?
Williams Peter C, Malec Kennan J, Menz William J, and 7 more
What technology area does this patent fall under?
Primary CPC classification F16L19/103. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Apr 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).