Heat sink
US-2024357768-A1 · Oct 24, 2024 · US
Radio frequency transistor and matching circuit grounding and thermal management apparatus
US8995933B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8995933-B2 |
| Application number | US-201313924123-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 21, 2013 |
| Priority date | Jun 21, 2013 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
In a communication device, a heat sink includes a solderable top surface with multiple upward facing swaging protrusions. A spacer is placed on top of the top surface of the heat sink with locating cut-outs on the spacer aligned with the swaging protrusions. A solder pre form is inserted into an opening in the spacer. The solder pre form includes locating features for alignment with the spacer and the swaging protrusions. The spacer is configured to restrict melted flow from the solder pre form to a defined area of the heat sink top surface. A printed circuit board including cut-outs and input and output connections for inserting a radio frequency device and further including locating holes for aligning the printed circuit board with the swaging protrusions is placed on top of the solder pre form and secured to the heat sink prior to a manufacturing process.
First claim
Opening claim text (preview).
We claim: 1. An apparatus comprising, a heat sink including a solderable top surface with multiple upward facing swaging protrusions; a spacer placed on top of the top surface of the heat sink with locating cut-outs on the spacer aligned with the swaging protrusions; a solder pre form inserted into an opening in the spacer, the solder pre form including locating features for alignment with the spacer and the swaging protrusions, the spacer being configured to restrict melted f…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H05K7/2039Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8995933B2 cover?
- In a communication device, a heat sink includes a solderable top surface with multiple upward facing swaging protrusions. A spacer is placed on top of the top surface of the heat sink with locating cut-outs on the spacer aligned with the swaging protrusions. A solder pre form is inserted into an opening in the spacer. The solder pre form includes locating features for alignment with the spacer …
- Who is the assignee on this patent?
- Motorola Solutions Inc, Motorola Solutions Inc
- What technology area does this patent fall under?
- Primary CPC classification H05K7/2039. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).