Suspension board with circuit and producing method thereof
US-2015380030-A1 · Dec 31, 2015 · US
Wiring circuit flexible substrate including a terminal section and a connecting section
US8995090B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8995090-B2 |
| Application number | US-201214003372-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 24, 2012 |
| Priority date | Mar 8, 2011 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A wiring circuit substrate, comprising: a metal support layer; an insulating layer formed on the metal support layer; a conductive layer for wiring formed on the insulating layer; and an opening formed so as to open at a same location in the insulating layer and the conductive layer for wiring, wherein the metal support layer includes: a support section that supports the insulating layer and the conductive layer for wiring, and a terminal section that extends from one edge side to the other edge side of the opening, the terminal section being separated from the support section; and the conductive layer for wiring includes a wiring that is connected to the terminal section by a connecting section.
First claim
Opening claim text (preview).
The invention claimed is: 1. A wiring circuit substrate, comprising: a metal support layer; an insulating layer formed on the metal support layer; a conductive layer for wiring formed on the insulating layer; and an opening formed so as to open at a same location in the insulating layer and the conductive layer for wiring, wherein the metal support layer includes: a support section that supports the insulating layer and the conductive layer for wiring, and a terminal s…
Assignees
Inventors
Classifications
- G11B5/486Primary
Physics · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8995090B2 cover?
- A wiring circuit substrate, comprising: a metal support layer; an insulating layer formed on the metal support layer; a conductive layer for wiring formed on the insulating layer; and an opening formed so as to open at a same location in the insulating layer and the conductive layer for wiring, wherein the metal support layer includes: a support section that supports the insulating layer and th…
- Who is the assignee on this patent?
- Nishiyama Jin, Narita Yuji, Dainippon Printing Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification G11B5/486. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).