Chip resistor and method of producing the same
US-9530546-B2 · Dec 27, 2016 · US
Chip resistor and method of manufacturing the same
US8994491B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8994491-B2 |
| Application number | US-201213716982-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 17, 2012 |
| Priority date | Aug 17, 2012 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).
First claim
Opening claim text (preview).
What is claimed is: 1. A chip resistor, comprising: a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes a glass material and at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni), and wherein the adhesion portion is formed in a stripe pattern or a lattice pattern. 2. The chip resistor of claim 1 , wherein the resistor…
Assignees
Inventors
Classifications
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US8994491B2 cover?
- There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).
- Who is the assignee on this patent?
- Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H01C7/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).