Fuses, and methods of forming and using fuses

US8994489B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8994489-B2
Application numberUS-201113276523-A
CountryUS
Kind codeB2
Filing dateOct 19, 2011
Priority dateOct 19, 2011
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Some embodiments include a fuse having a tungsten-containing structure directly contacting an electrically conductive structure. The electrically conductive structure may be a titanium-containing structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Some embodiments include a method of forming and using a fuse. The fuse is formed to have a tungsten-containing structure directly contacting an electrically conductive structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. Current exceeding the predetermined level is passed through the interface to rupture the interface.

First claim

Opening claim text (preview).

We claim: 1. A fuse, comprising: a tungsten-containing structure; an electrically conductive structure directly contacting the tungsten-containing structure; an interface between the tungsten-containing structure and the electrically conductive structure being configured to rupture when current through said interface exceeds a predetermined level; the electrically conductive structure being a titanium-containing structure; and wherein the tungsten-containing structure is a sub…

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What does patent US8994489B2 cover?
Some embodiments include a fuse having a tungsten-containing structure directly contacting an electrically conductive structure. The electrically conductive structure may be a titanium-containing structure. An interface between the tungsten-containing structure and the electrically conductive structure is configured to rupture when current through the interface exceeds a predetermined level. So…
Who is the assignee on this patent?
Redaelli Andrea, Servalli Giorgio, Micron Technology Inc
What technology area does this patent fall under?
Primary CPC classification H01H85/11. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).