Semiconductor memory device and manufacturing method of semiconductor memory device
US-2024313073-A1 · Sep 19, 2024 · US
US8994094B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8994094-B2 |
| Application number | US-201113235429-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 18, 2011 |
| Priority date | Mar 24, 2011 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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According to one embodiment, a nonvolatile semiconductor memory device includes first and second stacked body, first and second semiconductor pillars, a connecting portion, a first memory film, and a dividing portion. The stacked bodies include a plurality of electrode films stacked along a first axis and as interelectrode insulating film provided between the electrode films. The first and second semiconductor pillars penetrate through the first and second stacked bodies along the first axis, respectively. The connecting portion electrically connects the first and second semiconductor pillars. The first memory film is provided between the electrode film and the semiconductor pillar. The dividing portion electrically divides the first and second electrode films from each other between the first semiconductor pillar and the second semiconductor pillar, is in contact with the connecting portion, and includes a stacked film including a material used for the first memory film.
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What is claimed is: 1. A nonvolatile semiconductor memory device comprising: a first stacked body including a plurality of first electrode films stacked along a first axis and a first interelectrode insulating film provided between two layers of the first electrode films neighboring along the first axis; a first semiconductor pillar penetrating through the first stacked body along the first axis; a second stacked body juxtaposed with the first stacked body along a second axis…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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