Metal gates for semiconductor devices and method thereof
US-2024429281-A1 · Dec 26, 2024 · US
US8994087B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8994087-B2 |
| Application number | US-201313738493-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 10, 2013 |
| Priority date | Jan 12, 2012 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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According to one embodiment, a semiconductor device includes a substrate and a first transistor. The substrate has a major surface. The first transistor is provided on the major surface. The first transistor includes a first stacked body, first and second conductive sections, a first gate electrode, and a first gate insulating film. The first stacked body includes first semiconductor layers and first insulating layers alternately stacked. The first semiconductor layers have a side surface. The first conductive section is electrically connected to one of the first semiconductor layers. The second conductive section is apart from the first conductive section and electrically connected to the one of the first semiconductor layers. The first gate electrode is provided between the first and second conductive sections and opposed to the side surface. The first gate insulating film is provided between the first gate electrode and the first semiconductor layers.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a substrate having a major surface; a first transistor provided on the major surface; and a second transistor provided on the major surface, the first transistor including: a first stacked body including a plurality of first semiconductor layers and a plurality of first insulating layers alternately stacked along a first direction perpendicular to the major surface, each of the first semiconductor layers having a sid…
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