Semiconductor device and method for manufacturing the same

US8994087B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8994087-B2
Application numberUS-201313738493-A
CountryUS
Kind codeB2
Filing dateJan 10, 2013
Priority dateJan 12, 2012
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

According to one embodiment, a semiconductor device includes a substrate and a first transistor. The substrate has a major surface. The first transistor is provided on the major surface. The first transistor includes a first stacked body, first and second conductive sections, a first gate electrode, and a first gate insulating film. The first stacked body includes first semiconductor layers and first insulating layers alternately stacked. The first semiconductor layers have a side surface. The first conductive section is electrically connected to one of the first semiconductor layers. The second conductive section is apart from the first conductive section and electrically connected to the one of the first semiconductor layers. The first gate electrode is provided between the first and second conductive sections and opposed to the side surface. The first gate insulating film is provided between the first gate electrode and the first semiconductor layers.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor device comprising: a substrate having a major surface; a first transistor provided on the major surface; and a second transistor provided on the major surface, the first transistor including: a first stacked body including a plurality of first semiconductor layers and a plurality of first insulating layers alternately stacked along a first direction perpendicular to the major surface, each of the first semiconductor layers having a sid…

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What does patent US8994087B2 cover?
According to one embodiment, a semiconductor device includes a substrate and a first transistor. The substrate has a major surface. The first transistor is provided on the major surface. The first transistor includes a first stacked body, first and second conductive sections, a first gate electrode, and a first gate insulating film. The first stacked body includes first semiconductor layers and…
Who is the assignee on this patent?
Toshiba Kk
What technology area does this patent fall under?
Primary CPC classification H10D30/43. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).