Organic light emitting diode display and method of manufacturing the same

US8994063B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8994063-B2
Application numberUS-94671010-A
CountryUS
Kind codeB2
Filing dateNov 15, 2010
Priority dateNov 16, 2009
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  5. First independent claim

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Abstract

Official abstract text for this publication.

An organic light emitting diode display includes a flexible substrate, an organic light emitting diode disposed over the flexible substrate, and an encapsulation film disposed over the flexible substrate to encapsulate the organic light emitting diode, with the organic light emitting diode interposed between the encapsulation film and the flexible substrate. A thermal conduction layer contacts the flexible substrate, wherein the thermal conduction layer faces the organic light emitting diode and the flexible substrate is interposed between the thermal conduction layer and the organic light emitting diode. A first film is disposed over the encapsulation film, and a second film is disposed over the thermal conduction layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a light emitting diode display, the method comprising: forming a flexible substrate over a glass substrate; forming an organic light emitting diode over the flexible substrate; forming an encapsulation film over the flexible substrate to encapsulate the organic light emitting diode; separating the glass substrate from the flexible substrate; forming a perforated thermal conduction layer on a flat surface of the flexible subs…

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What does patent US8994063B2 cover?
An organic light emitting diode display includes a flexible substrate, an organic light emitting diode disposed over the flexible substrate, and an encapsulation film disposed over the flexible substrate to encapsulate the organic light emitting diode, with the organic light emitting diode interposed between the encapsulation film and the flexible substrate. A thermal conduction layer contacts …
Who is the assignee on this patent?
Lee Jae-Seob, Jin Dong-Un, Samsung Display Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10K59/873. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).