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US-12051612-B2 · Jul 30, 2024 · US
Light emitting diode package
US8994061B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8994061-B2 |
| Application number | US-201213410399-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 2, 2012 |
| Priority date | Mar 2, 2011 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A light emitting diode package includes a first lead frame comprising a first hole cup, a second lead frame comprising a second hole cup and disposed to face the first lead frame with a gap disposed between the first lead frame and the second lead frame, a first light emitting diode chip disposed on the first hole cup, and a second light emitting diode chip disposed on the second hole cup, the first lead frame comprising a first enlarged region formed between the gap and the first hole cup, and the second lead frame comprising a second enlarged region formed between the gap and the second hole cup.
First claim
Opening claim text (preview).
What is claimed is: 1. A light emitting diode package, comprising: a first lead frame comprising a first hole cup; a second lead frame comprising a second hole cup and disposed to face the first lead frame with a gap disposed between the first lead frame and the second lead frame; a first enlarged region formed between the gap and the first hole cup; a second enlarged region formed between the gap and the second hole cup; a first light emitting diode chip disposed on the f…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8994061B2 cover?
- A light emitting diode package includes a first lead frame comprising a first hole cup, a second lead frame comprising a second hole cup and disposed to face the first lead frame with a gap disposed between the first lead frame and the second lead frame, a first light emitting diode chip disposed on the first hole cup, and a second light emitting diode chip disposed on the second hole cup, the …
- Who is the assignee on this patent?
- Kang Do Hyoung, Kim Oh Sug, Seoul Semiconductor Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10H29/857. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).